发明名称 ADHESION METHOD FOR BATTERY FLAP
摘要 PROBLEM TO BE SOLVED: To make it possible to surely conduct bent welding of flap of a battery causing no defect. SOLUTION: Sequentially conducted are positioning process that positions a battery 1 at a specified location, adhesion film formation process that forms an adhered thin film layer 5 on a base pat 11 with a shape corresponding a flap portion 4 to be adhered, adhesion film copying process that copies the formed adhered thin film layer 5 on the flap portion 4 of the positioned battery 1 (S102 and S103), folding process that folds the flap portion that the adhered thin film layer 5 was copied (S104) and adhesion process that adheres the flap portion 4 on the outer face of the battery device 2 (S104).
申请公布号 JP2001110375(A) 申请公布日期 2001.04.20
申请号 JP19990285200 申请日期 1999.10.06
申请人 SONY CORP 发明人 KANO KENICHI;TAKEYAMA KATSUMI;HAYASAKA KOJI
分类号 H01M2/08;H01M2/02;(IPC1-7):H01M2/08 主分类号 H01M2/08
代理机构 代理人
主权项
地址