| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a 2-layer metal film carrier wherein a beam lead of an even thickness is formed. SOLUTION: A process where a through hole 28 and a device hole 29 are formed at an insulating film 27 wherein a first copper foil 25 is formed on the surface while an adhesive layer 26 is formed on the other surface, a process where a second copper 31 where a metal film 30 not eroded with a copper etching liquid is formed on one surface is bonded using the adhesive layer to the other surface of insulating film in such manner as bonding a metal film side onto the adhesive layer, a process where a first protective resist layer 33 is so formed as to cover the bonded second copper foil, a process where an electroless copper plated film 34 is formed on the first copper film as well as in a through hole and device hole, a process where a second protective resist layer 35 is so formed as to cover one surface of the insulating film except for the device hole, and an etching process where the electroless copper plated film in the device hole is removed with the second protective resist layer as a mask, are provided.
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