| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package substrate of high quality at a low cost. SOLUTION: A substrate comprising independent copper circuit patterns comprising no partial electrolytic plating lead wire is formed, and a pattern is formed with a solder resist. An electroless copper is deposited on the entire surface of substrate, and a solder surface is coated with a plating resist, with the electroless copper on a part surface dissolved and removed by etching. The pad of a part surface, copper-plated through hole, pad of solder surface, and electroless copper of solder surface are used as a conductor to precipitate an electrolytic nickel/gold coat on the copper pad of part surface. After the plating resist on the solder surface is removed, the electroless copper of solder surface is dissolved by etching before the pad of solder surface is processed with pre-flux. Thus, with no space for the conductive line for partial electrolytic plating required, an electrolytic nickel/gold coat is formed on a part surface while a pre-flux coat is formed on a solder surface.
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