| 摘要 |
PROBLEM TO BE SOLVED: To provide an SAW device together with its manufacturing method wherein the waviness or deflection of a substrate sheet is suppressed, deflection of each substrate is suppressed as well, and the deformation of a bump is stabilized with no degradation in productivity. SOLUTION: An SAW chip 6 where a bump 5 is formed on an electrode 7, and a substrate 1 where an electrode 2 is jointed through the SAW chip 6 and the bump 5, constitute an SAW device where a silicon substrate is used as the substrate 1. |
