| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component, which can exclude or cut down jigs for alignment and realize reduction in manufacturing cost and improvement of working efficiency. SOLUTION: After a substrate 2 is fixed to terminals 21-23 coupled with a lead frame 7, it is set in a built-in mold 8, and a case 1 is so set in the built-in mold 8 that a bottom part aperture 13 face the substrate 2. By operating the built-in mold 8 from the direction opposite to the case 1, a coupling part 72 between the lead frame 7 and the terminals 21-23 is cut, and the substrate 2 is made to engage with the bottom part aperture 13 of the case 1. The case 1 is pushed out in the direction opposite to the cutting direction, and the outer side surface of the case 1 is held temporarily with anchoring pawls 73 of the lead frame 7. After the lead frame 7 holding the case 1 is temporarily taken out from the built-in mold, the bottom part aperture 13 of the case 1 is filled with a sealing resin 6 and it is hardened in a sealing process. After that, the case 1 is isolated from the lead frame 7.</p> |
