| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board which is capable of suppressing the dimensional change of a mask material for exposure by using a glass substrate formed with mask patterns as the mask material for exposure and is consequently capable of preventing the mispositioning of via holes, plating resist patterns and solder resist patterns. SOLUTION: A photosensitive resin layer 6 is formed on the circuit board PC and is exposed via the glass substrate drawn with the mask patterns 14 and is developed, by which openings for the via holes and thereafter conductor circuits and the via hole are formed on the photosensitive resin layer. The photosensitive resin layer 6 is formed on the circuit board PC and is exposed via the glass substrate 13 drawn with the mask patterns 14 and is developed, by which the resist patterns are formed.</p> |
