| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate supporting device, and its heat-transfer method, wherein the heat-transfer efficiency between a base member and an electrostatic chuck is improved without jointing the base member to the electrostatic chuck. SOLUTION: A substrate supporting device 4 comprises a base member 5 which incorporates a heater or cooling device, and an electrostatic chuck 7 which, provided over the base member 5 with a heat-transfer sheet 6 in between, holds a semiconductor wafer W while sucking it. The base member 5 is provided with a gas guiding channel 13 for guiding a heat transfer gas. On the upper surface of the base member 5, a first gas retention channel 14 which, communicating with the first gas guiding channel 13, retains the beat transfer gas guided through the gas guiding channel 13 is formed. When the heat transfer gas is supplied to the first gas retention channel 14, the thermal coupling takes place through the heat transfer gas at the non-contact part between the base member 5 and the electrostatic chuck 7.</p> |
