| 摘要 |
PROBLEM TO BE SOLVED: To prevent chipping and break of a blade, and reduce the width of the scribe lane for semiconductor chips, by solving the natural vibration of a dicing device and increase by changes of the vibration over aging caused by the attachment gap, the abrasion, etc., of a blade (cutting edge) in the dicing process of a semiconductor wafer. SOLUTION: A vibration detecting and measuring device 4 is installed on the surface of a bearing 8 which supports a high-speed revolution flange 2 where a blade 1 is attached, and the signal of detected vibration is inputted into a comparative arithmetic circuit 6, and it is compared with the magnitude of the preset vibration so as to generate a control signal, and the vibration control signal is inputted into a vibration controller 3, thus the control to suppress the vibration of the blade within the specified range is performed. |
