| 摘要 |
PROBLEM TO BE SOLVED: To improve thermal resistance of an optical module by a method wherein, in the optical module having an insulation layer mounting an optical element on a substrate having a wave guide path, thermal resistance by the insulation layer is decreased and a thermal conduction in the other parts is increased. SOLUTION: An area of a solder or an electric wiring part 6 for fixing or driving an optical element 7 is greater than the area of the optical element 7, thereby diffusing heat from the optical element. A grounded silicon substrate 1 is electrically connected to the optical element 7 with a solder part 6, and an insulation layer 5 is provided between the optical element of an optical element mounting part 4 and the silicon substrate. In the other parts, the insulation layer is thinned, or eliminated, and a radiation solder is drawn around on the silicon substrate. Furthermore, the optical element mounted on the silicon substrate via the insulation layer 5 and the periphery of any or all of electric wirings for driving the optical element are coated with a transparent resin (with a wavelength of the optical element), and further coated with a resin of a high conductivity thereon. |
