发明名称 HEAT-RELEASE STRUCTURE FOR ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain sufficient heat-release effect for a printed board. SOLUTION: In an amplifying part 8, a printed board 9 is fixed at a front area in an inner case 10 to form a space 11 at a rear plate 4 of a main body case 3, and in a power source part 13, a printed board 14 is supported by a screwing boss 15 to form a space 16 at the rear plate 4. Furthermore, slits 19 are formed in an upper plate 5 and a lower plate 6 of the main body case 3 and an upper plate 17 and a lower plate 18 of the inner case 10, respectively, to form an air flow path 20 penetrating a containing box 2, at the rear side of the printed boards 9 and 14 along with the spaces 11 and 16.
申请公布号 JP2001111273(A) 申请公布日期 2001.04.20
申请号 JP19990289343 申请日期 1999.10.12
申请人 MASPRO DENKOH CORP 发明人 OHARA HISANORI
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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