The invention relates to the reinforcement of an integrated circuit module for a chip card. The inventive method uses at least one reinforcement element (1) which is stuck on the module for positioning inside the volume of the body of the card (6) and which has a greater elasticity modulus than that of the material from which the card is made. Said reinforcement element is fixed to the module (4) with an adhesive substance (5) which is applied to the face of said module to be embedded in the card and which serves to stick the module in a cavity (8) in the body of the card (6).
