CHIP CARD MODULE

摘要

The invention relates to a chip card module (1) which comprises a carrier layer (2). A semiconductor component (10) is fixed to the carrier layer by means of an adhesive polymer film (9). A diffusion barrier layer (8) is provided between the adhesive polymer film (9) and the carrier layer (2). After the semiconductor component (10) has been mounted on the adhesive polymer layer (9), said polymer layer is hardened.