| 发明名称 |
CHEMICAL MECHANICAL POLISHING A SUBSTRATE HAVING A FILLER LAYER AND A STOP LAYER |
| 摘要 |
A substrate (10) is chemical mechanical polished with a high-selectivity slurry until the stop layer (14) is at least partially exposed, and then the substrate (10) is polished with a low-selectivity slurry until the stop layer (14) is completely exposed.
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| 申请公布号 |
WO0025984(A9) |
申请公布日期 |
2001.04.19 |
| 申请号 |
WO1999US25183 |
申请日期 |
1999.10.26 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
JIN, RAYMOND, R.;LI, SHIJIAN;REDEKER, FRED, C.;OSTERHELD, THOMAS, H. |
| 分类号 |
B24B37/04;H01L21/3105;H01L21/321;H01L21/768;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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