发明名称 COOLING STRUCTURE FOR CONTROL APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a cooling structure for a control apparatus, in which adverse influence of dust upon the control apparatus is eliminated, when the controlling apparatus is cooled with cooling air. SOLUTION: A heat-release plate 14 is provided in a containing box 11 that contains a control apparatus 10 dissipating heat, a containing space 13 in the containing box 11 is partitioned into a first chamber 15 and a second chamber 16, the control apparatus 10 is contained in the first chamber 15, and further it is fitted to the heat-release plate 14. An intake port 18, through which external cooling air A is taken in the second chamber 16 and an exhaust port 19 through which the cooling air A is taken out of the second chamber 16, are provided, and a flow path 20 for the cooling air A extends from the intake port 18 to the exhaust port 19 in the second chamber 16, and a heat-releasing fin 17 is provided on the heat-release plate 14 to contain in the second chamber 16.
申请公布号 JP2001111274(A) 申请公布日期 2001.04.20
申请号 JP19990287448 申请日期 1999.10.08
申请人 TCM CORP 发明人 SHONO NOBUO;HIGAKI MASAMI;SOGABE YASUSHI
分类号 H01G2/08;F25D1/00;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01G2/08
代理机构 代理人
主权项
地址