| 摘要 |
PROBLEM TO BE SOLVED: To release heat efficiently without a broad area on a printed wiring board. SOLUTION: A heat-releasing board 10 that is fitted to an electronic component 1, such as a regulator dissipating heat, etc., mounted on a printed wiring board 2 and mounted upright to the printed wiring board 2 is provided. A plurality of heat-releasing holes 13 and each of notches 14 and 15 are formed on the heat-releasing board 10, and further copper foils 17 are applied to both surfaces, respectively.
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