| 摘要 |
PROBLEM TO BE SOLVED: To provide the method of manufacturing a thin film ceramic board with high reliability and high precision by a method wherein a melted deteriorated layer which is produced on the inner wall of the through-hole of the ceramic board when the through-hole is formed by a laser and obstructs the adhesion of a conductive film to the inner wall is removed without damaging the surface of the board. SOLUTION: A sand blast resistant protective layer 2 is formed over the whole surface of a ceramic board 1. A laser beam 4 is applied to a required position to form a continuous through-hole 5 in the sand blast resistant protective layer 1 and the ceramic board 1. A melted deteriorated layer 6 produced on the inner wall of the through-hole 5 is removed by sand blast. Then the sand blast resistant protective layer 2 is removed. After that, a conductive film 9 is formed on the surface and in the through-hole 5 of the ceramic board 1 to form a thin film circuit pattern 10.
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