| 摘要 |
An electrolytic gold plating liquid which employs either gold compound of a gold salt or a gold complex as a gold source and contains a buffer, an organic gloss agent and a conductive salt, wherein a non-cyan electrolytic gold plating liquid characterized by containing 1,2-ethanediamine is employed. The gold plating liquid provides a gold plating bath having extremely excellent solution stability, and is free from the change of physical properties of a gold metal precipitate or the decomposition of a gold plating liquid during gold plating operation, and further allows controlling the hardness, purity, crystal properties and the like of a gold metal precipitate. Accordingly, this gold plating liquid provides an electrolytic gold plating liquid superior to all of those conventionally and currently used. This gold plating liquid can be produced by employing, as a gold source, either of bis(1,2-ethane diamine) gold complex and a gold salt.
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