| 摘要 |
The invention relates to a tripping slide device for a thermal overload relay. One of a number of thermostatic bimetals engages with the tripping slide device, said number corresponding to the number of phases to be monitored. The slide device is displaced when at least one of the thermostatic bimetals bends and, by mean of this displacement, a breaker mechanism is tripped, which in turn opens a contact. Said slide device comprises two elongated, rectangular-shaped slide elements, which are coupled to the thermocouples. Each slide element comprises a number of slide plates (11, 12, 13, 11a, 12a, 13a), said number corresponding to the number of phases. The adjoining surfaces, situated against the bimetals (31, 32, 33), are each housed in a different recess.
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