发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:To realize high speed bonding by providing a spring mechanism fitted to a bonding arm in view of giving a specified bonding load to a capillary and a stopper in order to cancel a forced power by the second spring mechanism when the capillary reaches the area in the vicinity of bonding surface. CONSTITUTION:When a cam 7 starts rotation and a capillary 3 is set at the height of point A, a force of forced pin 10 is also applied to a bonding arm 1 in addition to force of load setting spring 4 and thereby it is prevented that the bonding arm 1 jumps up from a drive lever 5. When the cam 7 further continues rotation and the capillary 3 comes close to the area near the pellet surface, the forced pin 10 collides the wall of a housing 11, not giving a forced power to the bonding arm 1. Therefore, only a force of load setting spring 4 is applied to the bonding arm 1 and bonding to the pellet is carried out. When the cam 7 further rotates and when the capillary 3 exceeds the point X, a force of forced pin 10 is again applied to the bonding arm 1, helping the arm 1 to follow the drive lever 5.
申请公布号 JPS58216431(A) 申请公布日期 1983.12.16
申请号 JP19820098909 申请日期 1982.06.09
申请人 MITSUBISHI DENKI KK 发明人 IWATA MASANARI
分类号 H01L21/60 主分类号 H01L21/60
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