Apparatus and method for polishing workpiece

摘要

A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface (21), a top ring for holding a workpiece and pressing the workpiece against the polishing surface (21), a holding surface (3) of the top ring (2) for holding the workpiece, and a retainer ring (7) for retaining the workpiece within the holding surface of the top ring (2). The holding surface (3) is deformable by fluid having variable pressure, and the retainer ring (7) presses the polishing surface (21) under a variable pressing force.