发明名称 Thin-film thermal head incorporating conductive layer containing Cu-Ag alloy
摘要 A thin-film thermal head incorporating a resistance heating layer; and a conductor layer, wherein the main component of the conductor layer is a Cu-Ag alloy. More particularly, the conductor layer contains Cu by 50 atom % or higher, Ag by 0.5 atom % or higher and 50 atom % or lower and other elements by 2 atom % or lower.
申请公布号 US6219079(B1) 申请公布日期 2001.04.17
申请号 US20000518371 申请日期 2000.03.03
申请人 FUJI PHOTO FILM CO., LTD. 发明人 SHIMIZU OSAMU
分类号 B41J2/335;(IPC1-7):B41J2/335 主分类号 B41J2/335
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