发明名称 |
Thin-film thermal head incorporating conductive layer containing Cu-Ag alloy |
摘要 |
A thin-film thermal head incorporating a resistance heating layer; and a conductor layer, wherein the main component of the conductor layer is a Cu-Ag alloy. More particularly, the conductor layer contains Cu by 50 atom % or higher, Ag by 0.5 atom % or higher and 50 atom % or lower and other elements by 2 atom % or lower.
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申请公布号 |
US6219079(B1) |
申请公布日期 |
2001.04.17 |
申请号 |
US20000518371 |
申请日期 |
2000.03.03 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
SHIMIZU OSAMU |
分类号 |
B41J2/335;(IPC1-7):B41J2/335 |
主分类号 |
B41J2/335 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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