发明名称 Method and apparatus for radiation heating substrates and applying extruded material
摘要 A method and apparatus for applying an extrudable material to a substrate, in which a concentrated light beam is directed onto the substrate before or after the application of the extrudable material. The energy of the beam is concentrated on the substrate surface, wherein it is subsequently transferred to the extrudable material deposited on its surface, thereby increasing the temperature and lowering the viscosity of the closely situated material so as to facilitate material penetration into the substrate. This method allows the use of illumination of modest energy density, of wavelengths absorbed by the extrudable material, or of such cross-sectional extent that it may not be transmitted through the extrusion device by which the extrudable material is deposited. When the extrudable material is an adhesive and is applied to a plurality of substrates, of which at least one is treated with a light beam according to this method, and the extrudable materials adhered to the substrates are brought into contact, the joining of the extrudable materials creates a strong bond between the substrates. Also, differential material heating near the substrate can create differential material properties as a function of the distance from the substrate. In addition, uniform treatment can be provided through either closed-loop or open-loop process control.
申请公布号 US6217695(B1) 申请公布日期 2001.04.17
申请号 US19980187446 申请日期 1998.11.06
申请人 WMW SYSTEMS, LLC 发明人 GOLDBERG DAVID A.;FABERMAN IRA S.
分类号 B05D3/06;B32B7/04;B32B27/34;B32B38/00;H05B3/00;(IPC1-7):B32B31/12 主分类号 B05D3/06
代理机构 代理人
主权项
地址