| 摘要 |
PROBLEM TO BE SOLVED: To develop a new resin compound which maintains the characteristic physical properties of a thermosetting resin or photosensitive resin and simultaneously exhibits higher physical property values than the original physical property values of the compounded thermoplastic resin. SOLUTION: This method for producing a resin compound comprises curing a thermosetting resin or photosensitive resin mixed with a thermoplastic resin. Therein, the thermosetting resin or photosensitive resin is cured at a curing rate exceeding a pseudo homogeneous phase-forming point and/or at a phase- separating rate not exceeding the pseudo homogeneous phase-forming point, thus producing the resin compound having the pseudo homogeneously compatibilized structure. The diameter of the resin particles constituting the compound is <=0.1μm measured by the photographic measurement of a transmission electron microscope, and the resin has a glass transition temperature peak measured by the measurement of dynamic viscoelasticity. |
