发明名称 ANTISTATIC RESIN COMPOSITION AND THERMOPLASTIC RESIN COMPOSITION USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain an antistatic resin composition which exhibits a low surface resistance value in the electrically conductive region, and moreover, can obtain molded products with reduced dependence of the resistance value on moisture. SOLUTION: An antistatic resin composition comprises 50-99 wt.% component A and 1-50 wt.% component B, and component A is a cationically modified copolymer which contains 70-99 mol% ethylene structural units, 0-15 mol% acrylate structural units represented by formula I, and 1-30 mol% acrylamide structural units represented by formula II and has a weight average molecular weight of 1,000-80,000, and the component B is a sulfonate represented by the formula: (R7SO3)nM.
申请公布号 JP2001106850(A) 申请公布日期 2001.04.17
申请号 JP19990289063 申请日期 1999.10.12
申请人 DAI ICHI KOGYO SEIYAKU CO LTD 发明人 TSUBAKI TAKAYUKI;KIKUTA MANABU
分类号 C09K3/16;C08F8/00;C08F210/02;C08K5/42;C08L23/26;C08L101/00;C08L101/16;(IPC1-7):C08L23/26 主分类号 C09K3/16
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