发明名称 DMOS device structure, and related manufacturing process
摘要 A DMOS device structure includes a lightly doped semiconductor layer of a first conductivity type, a plurality of lightly doped semiconductor regions of a second conductivity type extending from a top surface of the lightly doped semiconductor layer thereinto, source regions of the first conductivity type contained in the lightly doped semiconductor regions and defining channel regions. The lightly doped semiconductor regions are contained in respective enhancement regions of the lightly doped semiconductor layer of the same conductivity type as, but with a lower resistivity than, the lightly doped semiconductor layer.
申请公布号 US6218228(B1) 申请公布日期 2001.04.17
申请号 US19970856261 申请日期 1997.05.14
申请人 CONSORZIO PER LA RICERCA SULLA MICROELETTRONICA NEL MEZZOGIORNO 发明人 ZAMBRANO RAFFAELE
分类号 H01L29/08;H01L29/739;H01L29/78;(IPC1-7):H01L21/823 主分类号 H01L29/08
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