发明名称 Substrate processing apparatus and substrate processing method
摘要 A substrate processing apparatus comprises a hot-wall type processing chamber for processing a substrate, a heater capable of heating an interior of the processing chamber, a substrate holder capable of holding the substrate and processing the substrate in the processing chamber in a state where the substrate holder holds the substrate, and a mechanism, which is capable of allowing the substrate holder to hold the substrate and then transferring the substrate holder holding the substrate into the processing chamber, and/or which is capable of carrying out the substrate holder from the processing chamber in a state where the substrate holder holds the substrate, and then separating the substrate from the substrate holder.
申请公布号 US6217663(B1) 申请公布日期 2001.04.17
申请号 US19970879932 申请日期 1997.06.20
申请人 KOKUSAI ELECTRIC CO., LTD. 发明人 INOKUCHI YASUHIRO;IKEDA FUMIHIDE;NISHIWAKI MICHIKO;TAKADA MASATOSHI;SUEYOSHI MAMORU
分类号 H01L21/00;H01L21/677;H01L21/687;(IPC1-7):C23C16/00 主分类号 H01L21/00
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