发明名称 |
Substrate processing apparatus and substrate processing method |
摘要 |
A substrate processing apparatus comprises a hot-wall type processing chamber for processing a substrate, a heater capable of heating an interior of the processing chamber, a substrate holder capable of holding the substrate and processing the substrate in the processing chamber in a state where the substrate holder holds the substrate, and a mechanism, which is capable of allowing the substrate holder to hold the substrate and then transferring the substrate holder holding the substrate into the processing chamber, and/or which is capable of carrying out the substrate holder from the processing chamber in a state where the substrate holder holds the substrate, and then separating the substrate from the substrate holder.
|
申请公布号 |
US6217663(B1) |
申请公布日期 |
2001.04.17 |
申请号 |
US19970879932 |
申请日期 |
1997.06.20 |
申请人 |
KOKUSAI ELECTRIC CO., LTD. |
发明人 |
INOKUCHI YASUHIRO;IKEDA FUMIHIDE;NISHIWAKI MICHIKO;TAKADA MASATOSHI;SUEYOSHI MAMORU |
分类号 |
H01L21/00;H01L21/677;H01L21/687;(IPC1-7):C23C16/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|