| 摘要 |
PROBLEM TO BE SOLVED: To almost smoothly form a thick surface plating layer on substrate plating as a tinned bar stock for electronic parts and to use the same for electronic parts such as capacitors, lead frames, connectors and lead pins. SOLUTION: The surface of a flat metallic base material is applied with substrate plating, moreover, a lead-free surface plating layer is formed all over the surface or beltlikely, the surface plating layer is composed of a tin or tin alloy with a thickness of 3 to 10μm, and, after reflowing treatment, the difference in the ruggedness in the surface plating layer of the bar stock is about <=2μm.
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