发明名称 Method for producing capacitor having hemispherical grain
摘要 A first amorphous silicon layer is formed to connect to a portion of a capacitor contact plug, and then a second amorphous silicon layer and a third amorphous silicon layer are formed thereon. The first and the third amorphous silicon layers are formed so that they have a lower impurity concentration than that in the second amorphous silicon layer. HSG (hemispherical grain) is grown on surfaces of the first and the third amorphous silicon layers, and subsequently an impurity is diffused from the second amorphous silicon layer to the HSG. In such a method for producing a capacitor, the size of the HSG can be appropriately and uniformly controlled, and depletion in the HSG is prevented.
申请公布号 US6218230(B1) 申请公布日期 2001.04.17
申请号 US19980190023 申请日期 1998.11.12
申请人 NEC CORPORATION 发明人 FUJIWARA SHUJI;HIROTA TOSHIYUKI
分类号 H01L27/04;H01L21/02;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/823 主分类号 H01L27/04
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