| 摘要 |
PROBLEM TO BE SOLVED: To provide an abrasive pad having excellent evenness of polishing and capable of optically detecting the end of polishing, and to provide a polishing end detecting method and a polishing device using the same. SOLUTION: In an abrasive pad to be used for chemical mechanical polishing device, a polishing layer of the abrasive pad has a polishing area having bubbles and a light permeable area having bubbles, and hole ratio of the polishing area (A1) and the hole ratio of the light permeable area (A2) are set so as to satisfy the relation A1>A2>0. |
