| 摘要 |
A pressure gauge in which the displacement tip of the Bourdon tube is sealed and secured to a bracket of an amplifier movement by a selected solder composition affording a failure response to an encountered overpressure at a pressure value lower than the burst pressure of the Bourdon tube. Overpressure causes a fracture in the solder to be incurred enabling release of the overpressure while a throttle plug situated in the inlet path to the Bourdon tube severely restricts continuing gas flow to the fracture site. As a consequence, released flow from the solder fracture will be at a pressure insufficient to potentially cause explosion of the gauge case/lens to occur.
|
