| 摘要 |
<p>PROBLEM TO BE SOLVED: To form fine holes in a substrate. SOLUTION: This processing method forms holes by recording an etching pattern (an area removed by etching) in a substrate, forming a prior machine hole inside the etching pattern, and executing the isotropic etching according to the etching pattern. In the case that the substrate is a photosensitive glass substrate 101, a latent image 105 is formed by disposing a photo mask 102 in a prescribed position on the photosensitive glass substrate 101 and irradiating ultraviolet rays 106. Next, the latent image 105 is crystallized by heating the photosensitive glass substrate 101. A prior machine hole 107 smaller than the latent image 105 is formed at the center of a portion formed with the latent image 105 by laser light. Next, the photosensitive glass substrate 101 is etched by hydrofluoric acid. The crystallized portion is selectively etched to form a hole 108.</p> |
