发明名称 SOLDERING FLUX
摘要 PROBLEM TO BE SOLVED: To provide a soldering flux, solder paste and wire solder which are excellent in solderability as well as joined assemblies of circuit boards and electronic parts dealing with fine pitching and the diversification of parts. SOLUTION: Rosin having an acid value ranging from 150 to 250 and a softening point ranging from 120 to 200 deg.C is added to the flux.
申请公布号 JP2001105180(A) 申请公布日期 2001.04.17
申请号 JP19990283870 申请日期 1999.10.05
申请人 SHOWA DENKO KK 发明人 SHOJI TAKASHI;AMITA HITOSHI;MURASE NORIKO
分类号 B23K35/363;B23K35/14;B23K35/22;H05K3/34;(IPC1-7):B23K35/363 主分类号 B23K35/363
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