发明名称 |
PROCESS FOR DIRECTLY METALLIZING CIRCUIT BOARDS |
摘要 |
The present invention relates to a process for directly metallizing circuit boards, preferably in a horizontal throughput system, with the omission of electrolyte that requires no outside current. A multi-functional adsorption layer is produced selectively on the non-conductive parts of the circuit boards, said layer being able to adsorb an oxidation agent and/or store, this in pores or which is itself an oxidation agent, and which then is brought to reaction with such monomers as are suitable for the formation of conductive polymers, and which are metallized by electroplating.
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申请公布号 |
CA2025337(C) |
申请公布日期 |
2001.04.17 |
申请号 |
CA19902025337 |
申请日期 |
1990.09.13 |
申请人 |
BRESSEL, BURKHARD;MEYER, HEINRICH;MEYER WALTER;GEDRAT, KLAUS |
发明人 |
BRESSEL, BURKHARD;MEYER, HEINRICH;MEYER WALTER;GEDRAT, KLAUS |
分类号 |
C08G61/12;C25D5/56;C25D7/00;H05K3/10;H05K3/18;H05K3/24;H05K3/42;(IPC1-7):C25D7/12;C25D5/54 |
主分类号 |
C08G61/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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