| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive adhesive which is used for fabrication, mounting, etc., of electronic components, reduces voids formed inside coated films and therefore allows little deterioration of properties caused by the voids and has a low viscosity and an excellent applicability. SOLUTION: An electroconductive adhesive in a paste form which reduces voids formed inside cured coated films, allows little deterioration in the electrical conductivity, the adhesion strength and the reliability such as the heat cycle characteristics, etc., caused by the voids and has a low viscosity and an excellent applicability, is easily obtained by using an electroconductive powder 12 having a tap density of from 3.5 to 5.0 g/cc in a resin 11 for a binder, and also by avoiding the use of organic solvents.
|
