发明名称 |
Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad |
摘要 |
The present invention is directed to semiconductor processing operations, and, more particularly, chemical mechanical polishing operations. The present invention is comprised of a method for qualifying new polishing pads used in a polishing tool without the necessity of polishing test wafers.
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申请公布号 |
US6217412(B1) |
申请公布日期 |
2001.04.17 |
申请号 |
US19990372017 |
申请日期 |
1999.08.11 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
CAMPBELL WILLIAM JARRETT;LANSFORD JEREMY |
分类号 |
B24B37/04;B24B49/03;H01L21/306;(IPC1-7):B24B49/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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