| 发明名称 |
Flip chip having integral mask and underfill providing two-stage bump formation |
| 摘要 |
The present invention relates to a process for forming a two-stage bump on a flip chip. The process employs an underfill material which can be formed to act as a mask for application of bumps formed from a first composition to the flip chip. A material having a different composition can then be applied to the bumps. |
| 申请公布号 |
AU7484700(A) |
申请公布日期 |
2001.04.17 |
| 申请号 |
AU20000074847 |
申请日期 |
2000.09.14 |
| 申请人 |
ALPHA METALS, INC. |
发明人 |
KENNETH BURTON GILLEO;DAVID BLUMEL |
| 分类号 |
H01L21/56;H01L21/60;H01L21/68;H01L23/485 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
