| 摘要 |
PROBLEM TO BE SOLVED: To provide moisture-curable hot-melt adhesive compositions which have excellent adhesion in the uncured state at normal temperatures and extremely reduce the amount of carbon dioxide gas to be generated on moisture- curing and accordingly, do not cause lowering of adhesive strength and a failure in the external appearance such as dimensional abnormality due to the bubbles remaining in the adhesive layer. SOLUTION: Moisture-curable hot-melt adhesive compositions contain, as the major component, a urethane polymer having isocyanate groups at both molecular terminals and have a content of isocyanate groups of (1-6)×10-4 mol/g, a specific heat, calculated from the peak area of the crystal melting point by differential scanning calorimetry, of not more than 50 J/g, and a shear adhesive strength, measured according to the shear adhesive strength test of JIS Z-0237 (reference), of not less than 1 kgf/cm2.
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