发明名称 Surface mounting method of electronic components
摘要 In a method of mounting electronic components on a surface, where an electronic component is picked up by a moving head and is mounted onto a printed circuit board, a board recognition camera moves together with a mounting head and recognizes a recognition point set on a first board block of a board which is divided into a plurality of sections. After mounting an electronic component onto the first board block, a judgement is made whether or not a recognition point exists along the travelling path of the mounting head from a mounting position to the place for the next action. When it is judged that there is a recognition point, the board recognition camera is moved to the recognition point during the travelling and causes the camera to recognize the recognition point. As a result, useless travelling of the mounting head is eliminated and a tact time is shortened.
申请公布号 US6216341(B1) 申请公布日期 2001.04.17
申请号 US19990354569 申请日期 1999.07.16
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NAKAHARA KAZUHIKO
分类号 H05K13/04;H05K13/08;(IPC1-7):H05K3/30 主分类号 H05K13/04
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