| 摘要 |
PROBLEM TO BE SOLVED: To obtain a flame-retardant epoxy resin composition capable of giving a molding material which is excellent in flame retardance and affects the environment very little and to provide a semiconductor device which is prepared by using the composition and is excellent in flame retardance and resistance to soldering heat. SOLUTION: This composition contains (A) an epoxy resin, (B) a curing agent containing a modified phenol resin which is obtained by the polycondensation of a heavy oil or pitch, a phenol, and a formaldehyde compound in the presence of an acid catalyst and has a hydroxyl equivalent of 150-300 and a melt viscosity at 150 deg.C of 40 P or lower, and (C) an inorganic filler in an amount of 40 wt.% or higher but lower than 70 wt.%. The semiconductor device is sealed with a curing product of the composition. |
