| 摘要 |
A method for treating a surface of a first metallic component with an arrangement that includes (i) a receptacle, (ii) a polishing media located within the receptacle, and (iii) a mixing device operative to cause relative movement between the polishing media and the first metallic component is disclosed. The method includes the following steps (i) positioning the first metallic component within the receptacle so that the surface of the first metallic component is in contact with the polishing media, (ii) actuating the mixing device such that the mixing device causes relative movement between the polishing media and the surface of the first metallic component so that the polishing media polishes the surface of the first metallic component, and (iii) placing a chemical agent within the receptacle so that the chemical agent is in contact with the surface of the first metallic component at the same time the surface of the first metallic component is in contact with the polishing media such that the chemical agent causes an adherent chemical layer to be disposed on the surface of the first metallic component, wherein the adherent chemical layer reduces friction between the surface of the first metallic component and a surface of a second metallic component when the surfaces are in contact with each other. An associated arrangement is also disclosed.
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