| 摘要 |
A multi-layer printed circuit board that incorporates one or more heating elements 310 in one of its intermediate layers such that during assembly, after screen printing solder paste and the placement of components, electrical power can be applied to the heating elements to locally raise the temperature of the printed circuit board to the level required to reflow the solder paste and create the electrical joint between the component leads 255 and the board conductor tracks 225. |
