发明名称 METHOD FOR INCREASING SIZE OF CAPACITOR OF VERY LARGE SCALE INTEGRATED CIRCUIT ON BULK SILICON WAFER AND SILICON-ON-INSULATOR WAFER AND STRUCTURE MANUFACTURED THEREBY
摘要 PURPOSE: A method for manufacturing a semiconductor device is provided to form an inexpensive capacitor without additional cost, and to increase the density of the capacitor by increasing a ratio of a silicon width to an interval between adjacent islands so that a sub-lithography characteristic is patterned. CONSTITUTION: At least one conductive island having a predetermined sidewall angle in a conductive substrate is formed. A dielectric material is formed on at least one conductive island. A conductive material is formed on the dielectric material. A contact between the conductive material and at least one conductive island is formed.
申请公布号 KR20010029757(A) 申请公布日期 2001.04.16
申请号 KR20000029105 申请日期 2000.05.29
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 LOUIS L. SHU;WANG LI KONG
分类号 H01L29/78;H01L21/02;H01L21/334;H01L27/08;H01L27/12;H01L29/94;(IPC1-7):H01L29/78 主分类号 H01L29/78
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