MOUNTING ARRANGEMENT FOR SECURING AN INTEGRATED CIRCUIT PACKAGE TO A HEAT SINK,申请号KR1020007004247-传众专利搜索

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发明名称	MOUNTING ARRANGEMENT FOR SECURING AN INTEGRATED CIRCUIT PACKAGE TO A HEAT SINK
摘要
申请公布号	KR20010031260(A)	申请公布日期	2001.04.16
申请号	KR1020007004247	申请日期	2000.04.20
申请人		发明人
分类号	H01L23/40	主分类号	H01L23/40
代理机构		代理人
主权项
地址

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