发明名称
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and method of transferring a wafer, using a ring boat having a wafer hold plate to avoid causing a nonuniform distribution of the temp. or stress in a wafer when it is heat-treated in a vertical furnace. SOLUTION: Using a ring boat 6 having removable wafer holding plates 1, a wafer 2 is transferred not on the boat but with a preset part 8 comprising a fixed block 9 and fixed pin 10. The wafer is pushed up by the pin 10 only when the hold plate 1 is put on the block 9 to form a gap for inserting a transfer fork 3 between the wafer 2 and holding plates 1. The fork 3 is inserted here to lift the wafer 2 and carry it between the preset part 8 and carrier 11. For carrying it between the boat 6 and preset part 8, the plates 1 is lifted by the fork 3.
申请公布号 JP3157738(B2) 申请公布日期 2001.04.16
申请号 JP19970044142 申请日期 1997.02.27
申请人 发明人
分类号 H01L21/677;H01L21/22;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
代理机构 代理人
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