METHOD AND APPARATUS FOR CONTROLLING TEMPERATURE OF SEMICONDUCTOR SUBSTRATE

摘要

PURPOSE: A method and apparatus for controlling temperature of semiconductor substrate is provided to supply a uniform temperature over the whole wafer support surface of a wafer support pedestal by quickly adjusting the temperature of a wafer to a prescribed value and maintaining the wafer at the temperature. CONSTITUTION: The semiconductor wafer processing apparatus has a substrate support(400), an isolator(406) disposed beneath substrate support, and; an external heat transfer plate(408) disposed beneath isolator. The semiconductor wafer placed on the support pedestal is maintained uniformly at a prescribed temperature by heating the wafer with one or more electrodes embedded in the substrate support and cooling the wafer with a fluid passing through the first and second heat transfer plates.