发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PURPOSE: A semiconductor device is provided to solve a problem of a difficult when providing a short process a low-resistance contact plug which is free from a diffusion layer leakage to a memory cell part of shallow junction, or a low-resistance contact plug to a peripheral circuit of comparatively deep junction other than a memory cell part in a multi-functional semiconductor device, which includes fine memory cells. CONSTITUTION: An interval between gate electrodes(181) in a memory cell part(180) and another interval between gate electrodes(182) in a peripheral circuit part are set so as to have a certain relation with the width of the sidewall insulating films(183) and(184) of a gate electrode, and furthermore a contact(167) is selectively bored in a memory cell part(180) first taking advantage of a stopper film(185), the base of the contact(167) is filled with a silicon layer(170), by which an optimal electrode structure can be formed on an N-type diffusion layer(164) in the memory cell part(180) and an N-type diffusion layer(165) in the peripheral circuit part, respectively.
申请公布号 KR20010030293(A) 申请公布日期 2001.04.16
申请号 KR20000052930 申请日期 2000.09.07
申请人 NEC CORPORATION 发明人 HAMADA TAKEHIKO;MATSUKI TAKEO;OKUBO HIROAKI
分类号 H01L21/28;H01L21/285;H01L21/469;H01L21/768;H01L21/8234;H01L21/8242;H01L23/522;H01L27/088;H01L27/10;H01L27/108;(IPC1-7):H01L27/10 主分类号 H01L21/28
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