| 摘要 |
PURPOSE: A resin-encapsulated semiconductor device is to provide a high-reliability and low-cost semiconductor device by reducing the size of a BGA semiconductor device and improving the connectivity of a wiring pattern. CONSTITUTION: A semiconductor ship(15) is packaged on a frame substrate composed of metal foil having a wiring pattern(14) formed by electrolytic plating on an upper surface and after the semiconductor chip(15) is sealed with a mold resin(17), the metal foil is etched from a lower surface and formed as a land(13) connected to the wiring pattern. Since the semiconductor chip(15) is packaged on the wiring pattern(14) having satisfactory connectivity, the reliability of wiring is improved, the entire thickness is reduced, the degree of freedom is applied to the location of external terminals(18) and it is possible to meet the demand for size reduction of the semiconductor device. |
