发明名称 Deposition of metal carbide film on substrate, e.g. integrated circuit, involves atomic layer deposition
摘要 A transition metal carbide is deposited by atomic layer deposition. An independent claim is also included for a method of producing an electron conductor in an integrated circuit by atomic layer deposition process, such that each of the cycles involves exposing an adsorbed metal complex on a substrate to a carbon compound.
申请公布号 FI19992235(A) 申请公布日期 2001.04.16
申请号 FI19990002235 申请日期 1999.10.15
申请人 ASM MICROCHEMISTRY LTD, 发明人 ELERS,KAI-ERIK;SAANILA,VILLE;KAIPIO,SARI;SOININEN,PEKKA
分类号 C23C16/44;C30B25/02 主分类号 C23C16/44
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