发明名称 |
PHOTORESIST REMOVING SOLUTION AND METHOD FOR REMOVING PHOTORESIST USING THE REMOVING SOLUTION |
摘要 |
PURPOSE: To provide a photoresists removing solution excellent in ability to remove residue such as a degenerated photoresist film produced after ashing and residue on etching (metal deposition) and excellent in property of preventing the corrosion of a substrate in rising with water and to provide a method for removing a photoresist using the removing solution. CONSTITUTION: The salt of hydrofluoric acid and a metal ion-free base, a water- soluble organic solvent, a basic material and water are blended to obtain the objective photoresist removing solution. A substrate is subjected to etching and ashing in succession with a photoresist pattern formed on the substrate as a mask, the photoresist pattern is removed using the removing solution and then the substrate is rinsed with water.
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申请公布号 |
KR20010030323(A) |
申请公布日期 |
2001.04.16 |
申请号 |
KR20000053172 |
申请日期 |
2000.09.07 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
KOBAYASHI MASAKAZU;WAKIYA KAZUMASA |
分类号 |
H01L21/027;G03F7/42;H01L21/02;H01L21/304;H01L21/311;H01L21/3213;(IPC1-7):G03F7/42 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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