发明名称 PHOTORESIST REMOVING SOLUTION AND METHOD FOR REMOVING PHOTORESIST USING THE REMOVING SOLUTION
摘要 PURPOSE: To provide a photoresists removing solution excellent in ability to remove residue such as a degenerated photoresist film produced after ashing and residue on etching (metal deposition) and excellent in property of preventing the corrosion of a substrate in rising with water and to provide a method for removing a photoresist using the removing solution. CONSTITUTION: The salt of hydrofluoric acid and a metal ion-free base, a water- soluble organic solvent, a basic material and water are blended to obtain the objective photoresist removing solution. A substrate is subjected to etching and ashing in succession with a photoresist pattern formed on the substrate as a mask, the photoresist pattern is removed using the removing solution and then the substrate is rinsed with water.
申请公布号 KR20010030323(A) 申请公布日期 2001.04.16
申请号 KR20000053172 申请日期 2000.09.07
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 KOBAYASHI MASAKAZU;WAKIYA KAZUMASA
分类号 H01L21/027;G03F7/42;H01L21/02;H01L21/304;H01L21/311;H01L21/3213;(IPC1-7):G03F7/42 主分类号 H01L21/027
代理机构 代理人
主权项
地址
您可能感兴趣的专利