发明名称 SEMICONDUCTOR PROCESSING TECHNIQUE
摘要 <p>PURPOSE: To provide a manufacturing environment 110 for a wafer fabrication processing and an SPC environment 112 for setting control limits and acquiring data for production runs. CONSTITUTION: A computation environment 114 processes SPC data, and the SPC data is analyzed in an analysis environment 116. An EMS environment 118 evaluates the analysis and automatically executes a process intervention, if the process lies outside the control limits. In addition, this technique provides for an electrical power management system, a spare parts inventory, and a scheduling system, and a wafer fabrication process system. These systems employ algorithms 735, 1135, and 1335.</p>
申请公布号 KR20010029775(A) 申请公布日期 2001.04.16
申请号 KR20000030185 申请日期 2000.06.01
申请人 APPLIED MATERIALS INC. 发明人 NULMAN JAIM
分类号 H01L21/02;G05B19/418;H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/02
代理机构 代理人
主权项
地址